J. L. Herring and W. J. R. Hoefer
13th Annual Review of Progress in Applied Computational Electromagnetics (ACES), Monterey, California USA, March 17-21 1997, pp 1410-1417.
The application of graded mesh and multigrid techniques to the modeling of microwave components in 3-dimensions with the TLM method are discussed. Comparisons are made for graded mesh and multigrid interfaces in a waveguide, for a non-touching axial strip placed in a waveguide, and for a microstrip impedance step. The issues of appropriate excitation and absorbing boundary conditions are addressed. It is shown that multigrid techniques provide an effective means of reducing the mesh resolution away from discontinuities.
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